| 摘要 |
<p>A heat-resistant microporous film which comprises a thermoplastic resin having a crystal melting point of 140 to 300 °C and has a layer structure formed in the direction of thickness, wherein the layer structure comprises 5 to 100 % of a layer defined by (A) below and 0 to 95 % of a layer defined by (B) below: (A) a layer having only micropores which are voids within a spherulite, and (B) a layer having micropores which are voids within a spherulite and micropores which are voids being present between spherulites.</p> |
