| 摘要 |
<p>A device for polishing the outer peripheral edge of a semiconductor wafer, comprising a rotating mechanism (2) for mounting a laminate (1) of semiconductor wafers (4) thereon and rotating them, and a polishing mechanism (3) disposed movable in the radial direction of the rotating mechanism (2), for polishing non-contactingly the outer peripheral edges of the rotating semiconductor wafers (4). An abrasive liquid is introduced into a fine gap (S) formed between the rotating column (10) of the polishing mechanism (3) and the laminate (1) of the wafers (4). The outer peripheral edges of the wafers (4) are polished non-contactingly by abrasive grains contained in the abrasive liquid.</p> |
