Verfahren zur Herstellung von Leitern in Kontaktlöcher in vielschichtigen Keramiksubstraten

摘要

Conductive paste for via connection (6) of a multilayer ceramic substrate (K), comprising: an inorganic component which consists of 30.0 to 70.0 % by weight of powder of conductive material and the remainder being one of glass powder having a softening point higher than a starting point of sintering of insulating material and crystalline glass ceramic powder having a glass transition point higher than the starting point of sintering of the insulating material; and an organic vehicle component which consists of at least organic binder and solvent.