发明名称 ABATEMENT OF EFFLUENTS FROM CHEMICAL VAPOR DEPOSITION PROCESSES USING ORGANOMETALLICSOURCE REAGENTS
摘要 A method and apparatus for abatement of effluent from a CVD process using a source reagent having a metal organic loosely bound to an organic or organometallic molecule such that upon exposure to heat (36) such bond is readily cleavable, e.g., copper deposition process involving the formation of films on a substrate (32) by metalorganic chemical vapor deposition (CVD) utilizing a precursor composition (16) for such film formation. The abatement process in specific embodiments facilitates high efficiency abatement of effluents from copper deposition processes utilizing Cu(hfac)TMVS as a copper source reagent (14).
申请公布号 WO0128917(A1) 申请公布日期 2001.04.26
申请号 WO2000US28846 申请日期 2000.10.18
申请人 ADVANCED TECHNOLOGY MATERIALS, INC. 发明人 HOLST, MARK;DUBOIS, RAY;ARNO, JOSE;FALLER, REBECCA;TOM, GLENN
分类号 B01D53/64;B01D53/04;B01J20/08;B01J20/10;B01J20/20;B01J20/34;C23C16/18;C23C16/44;(IPC1-7):C01B7/00;C01C3/00;B01D47/00 主分类号 B01D53/64
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