ADHESIVE BONDING METHOD AND DEVICE

摘要

A bonding method which includes heating an electrically conductive substrate with an induction heating system. The electrically conductive substrate is suitable for receiving a bonding agent which includes a pressure sensitive adhesive or a hot melt adhesive. The bonding agent is attached to a non- conductive substrate. The contact surface of the substrate is heated with th e induction heating system to elevate the temperature of the contact surface. The heated surface enhances the wet out of the bonding agent upon applicatio n of the bonding agent onto the substrate.