POLISHING MATERIAL, METHOD FOR POLISHING SUBSTRATE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To produce a polishing material that can polish the surface of a substrate such as a silica film without leaving scratches thereon. SOLUTION: Provided are a polishing material prepared by dispersing hollow microparticles or microparticles containing a liquid phase within them in a medium, a method for polishing therewith, and a semiconductor device using a substrate polished therewith. It is preferable that the microparticles have a median particle diameter of 1-500 nm. The microparticles are exemplified by ones made of a substance represented by the formula: SiOx (wherein (x) is 0.9-2.20) and having a bulk density equal to 10-90% of the true density. The medium is exemplified by water optionally containing a dispersant.