ELECTROPLATING OF COPPER FROM ALKANESULFONATE ELECTROLYTE

摘要

PROBLEM TO BE SOLVED: To provide an improved electrolytic prescription for electrodepositing copper on the base of an electronic device and a method for using this prescription. SOLUTION: This prescription is a solution which contains a copper alkanesulfonate and free alkanesulfonic acid and is intended for metallization of trenches or vias of a micron or submicron size.