| 摘要 |
PROBLEM TO BE SOLVED: To provide an organic copper compound which is used for metal organic chemical vapor deposition, is scarcely decomposed in a stored state before formed into a film, has a long life, gives an enhanced film-forming speed, can efficiently be decomposed on a substrate, has high evaporability, and has excellent adhesivity to base films. SOLUTION: The solution raw material for forming thin copper films comprises a copper+1(allylalkoxysilane)(hexafluoroacetylacetone) or is obtained by dissolving copper+1(allyltrimethylsilane) (hexafluoroacetylacetone), copper+1(trimethylvinylsilane) (hexafluoroacetylacetone) or copper+1(trimethoxyvinylsilane) (hexafluoroacetylacetone) in the copper+1(allylalkoxysilane) (hexafluoroacetylacetone) as a solvent. At least one of allyltrimethylsilane, trimethylvinylsilane, trimethoxyvinylsilane and allyltrimethoxysilane is preferably further added to the solution.
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