| 摘要 |
Cooling liquids such as fluorocarbons are enclosed within a module containing electronic components on a printed wiring board. Preferably top and bottom covers are applied to the top and bottom of the board and liquid-sealed thereto. Hot-melt adhesive is used for the seal. Each edge of a top cover has an outward-extending flange formed with a peripheral downward turned lip. Heated adhesive is applied to the cover in a continuous bead around the flange, the thickness of the bead being greater than the height of the lip. The cover is then squeezed against the board so that the adhesive seals against the board and the flange. The bottom cover is formed in complementary fashion.
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