RESIN COMPOSITION FOR SURFACE MOUNT CONNECTOR AND SURFACE MOUNT CONNECTOR USING THE SAME

摘要

PROBLEM TO BE SOLVED: To obtain a resin composition for a surface mount(SMT) connector without a fear of causing defective conduction or peeling when connecting plural electroconductive members (contacts or conductive pins) held by a holding insulator of a member other than that of a printed circuit substrate to plural lands provided in the printed circuit substrate with a solder and provide the SMT connector using the resin composition. SOLUTION: This holding insulator of the SMT connector comprises an inorganic composite resin material having 10-50 ppm/K coefficient of linear expansion at a temperature within the range of -50 to +250 deg.C and >=230 deg.C deflection temperature under load of 1.8 MPa.