| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a dry film laminator capable of enhancing the lamination quality of a copper-clad laminated sheet and a dry film so as to make a defect such as breakage or residual copper hard to generate at the time of formation of a fine pattern circuit. SOLUTION: In a dry film laminator wherein a copper-clad laminated sheet 1 and dry films 2A, 2B are thermally bonded under pressure by laminating rolls 3A, 3B to form resist layers on the copper-clad laminated sheet, preheating rolls 4A, 4B for preheating the copper-clad laminated sheet 1 and film preheating parts 5A, 5B for preheating the dry films 2A, 2B are provided to the front stage of the laminating rolls 3A, 3B.</p> |
