摘要 |
The invention relates to a device for cooling a planar inductance coil, in particular a planar transformer, on a plate-shaped support having a plurality of conducting layers, wherein at least one conducting layer of the support, in co-operation with a core element designed to guide a magnetic flux, provides the planar inductance coil, wherein on its first side towards a surface of the support the core element is connected to said side by means of a heat-conducting adhesive and on a second planar outside surface it is preferably substantially over the entire surface glued to a cooling element having a planar contact surface.
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