| 摘要 |
Methods for hermetically sealing an interface surface of ceramic materials, such as zirconia, to an interface surface of metallic materials, such as titanium alloys, using a titanium-nickel alloy filler material are disclosed. Preferred ceramic materials include stabilized zirconia materials; preferred metallic materials include titanium-niobium alloys; and a preferred titanium-nickel filler material is a 50-50 titanium-nickel alloy. At least one of the interfaces is contacted by the titanium-nickel alloy filler material and sealing is accomplished under vacuum conditions at temperatures of from 900 to 1200° C. during application of pressure to the joint. The methods are especially suitable for use in hermetically sealing ceramic and metallic components for applications such as implantable medical devices, electrical connectors, electronic packages, sporting goods, structural components, and the like.
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