| 摘要 |
PROBLEM TO BE SOLVED: To prepare an electrically conductive adhesive for directly connecting electrodes of semiconductor chips or electronic components or for directly connecting electrodes of electronic components containing semiconductor chips or semiconductor packages, and a wiring board having an excellent connection reliability by connecting conductor patterns and electrodes of electronic components using this electrically conductive adhesive. SOLUTION: This electrically conductive adhesive comprises, based on 100 pts.wt. epoxy resin, from 100 to 400 pts.wt. epoxy group-containing acrylic copolymer containing from 1 to 6 wt.% glycidyl (meth)acrylate and/or from 50 to 1,000 pts.wt. polyamide imide copolymer containing from 20 to 80 wt.% polysiloxane and from 200 to 1,000 pts.wt. metal particle. In a wiring board, a conductor pattern is connected with electrodes of an electronic component using this electrically conductive adhesive.
|
