Epoxy resin composition for encapsulating photosemiconductor element and photosemiconductor device

摘要

An epoxy resin composition for encapsulating a photosemi-conductor element excellent in releasing property from a mold in forming and in adhesion to the photosemi conductor element is provided. The epoxy resin composition comprises element comprising the following components (A) to (D):(A) an epoxy resin;(B) a hardener;(C) a silane coupling agent having an epoxy group, a mercapto group or an amino group; and(D) a releasing agent in which a molecule thereof has structure moieties represented by the following general formulas (1) and (2) and in which the weight ratio of the structure moiety represented by general formula (2) is 25% to 95% by weight based on the whole molecule, wherein m is a positive integer of 8 to 100 and wherein n is a positive integer.