发明名称 CUTTING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a cutting apparatus which can cut a thin-plate-shaped workpiece such as a ceramic green sheet laminate into a large number of small- sized rectangular chips at a high speed and with high precision and high quality and, besides, which shortens a time for machining the workpiece and also is excellent in durability. SOLUTION: This apparatus is equipped with a movable frame 10 which is constituted in a substantially square shape practically by providing and fixing an upper frame 12 and a lower frame 13 on the upper end side and lower end side of right and left guide posts 11 respectively and with a working base 20 through which the intermediate parts of the right and left guide posts 11 are inserted and which supports the movable frame 10 elevatably. A cutting mechanism 30 provided practically at the center in the lateral direction of the upper frame 12 and practically at the center of the longitudinal direction thereof makes a cutting edge 31 move forward and backward vertically, and thereby a workpiece W set on a workpiece setting stage 50 on the working base 20 is cut into a large number of small-sized rectangular chips.
申请公布号 JP2001113520(A) 申请公布日期 2001.04.24
申请号 JP19990298729 申请日期 1999.10.20
申请人 UHT CORP 发明人 YASOTA HISASHI;TSUCHIDA TAKASHI;WAKABAYASHI NORIYUKI
分类号 B28D1/22;B28D5/00;(IPC1-7):B28D1/22 主分类号 B28D1/22
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