发明名称 ELECTROPLATING TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To make the man power saving and rationalizing of an electroplating treatment device higher than heretofore by devising the intricate work of mounting and dismounting works to and from jigs like heretofore to the simple work of merely involving the insertion and removal of the works into and out of a basket, whereas, with the conventional system of the plating treatment, many operators are needed for the intricate work of mounting and dismounting the works because of the structure to execute power feeding and holding by mounting the works in the form of having the works pinched in the jigs utilizing the force of springs or the like. SOLUTION: This electroplating treatment device for various kinds has the structure to enable the plating treatment by installing an in-liquid power feeder 8 for feeding electricity to the works 1 in the inside bottom of a plating treating vessel 9 in such a manner that, when the basket 2 for transportation treatment in the state of inserting and holding the works 1 therein is immersed in the plating treating vessel 9, the in-liquid power feeder 8 intrudes into the bottom of the basket 2 and the works 1 held in the basket 2 comes into contact with the in-liquid power feeder 8 in the form of riding thereon and the electricity is fed to the works 1 from the in-liquid power feeder 8.
申请公布号 JP2001115300(A) 申请公布日期 2001.04.24
申请号 JP19990328644 申请日期 1999.10.14
申请人 ANDO YOSHIO 发明人 ANDO YOSHIO
分类号 C25D21/00;C25D17/08;(IPC1-7):C25D21/00 主分类号 C25D21/00
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