| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing resin composition that can give a high-reliability sealed semiconductor device improved in the adhesion of the resin composition and a pre-plated frame, especially, a frame pre-plated with Pd, Pd-Au, or the like and therefore in reflow resistance and made proof against moisture deterioration after reflow. SOLUTION: Provided are a sealing resin composition essentially consisting of (A) an epoxy resin, (B) a novolac phenolic resin, (C) 2,4,6-triazinetrithiol sodium salt, and (D) an inorganic filler and containing 0.004-0.2 wt.%, based on the resin composition, component C and 25-95 wt.%, based on the resin composition, component D, and a sealed semiconductor device prepared by sealing a semiconductor chip with the composition.
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