发明名称 EPOXY RESIN COMPOSITION AND INSULATING AND SEALING MATERIAL USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition that gives epoxy resin cured products having excellent balance between the dielectric breakdown strength, the creep properties, the high-temperature endurant strength, the resistance against humidity and the like. SOLUTION: This epoxy resin composition characteristically comprises, as essential components, (A) an epoxy resin, (B) a curing agent, and (C) a curing accelerator in which the main component of the curing agent (B) is methylnorbornane-2,3-dicarboxylic anhydride and the amount of the succinic anhydride is <=0.4 wt.% in the curing agents.
申请公布号 JP2001114868(A) 申请公布日期 2001.04.24
申请号 JP19990292196 申请日期 1999.10.14
申请人 TONEN CHEM CORP;NEW JAPAN CHEM CO LTD 发明人 KIKUCHI SHINTARO;TAKATSUNA KAZUTOSHI;FUJINAMI HIDEYUKI;NOBE TOMIO
分类号 C08G59/42;H01L23/29;H01L23/31;(IPC1-7):C08G59/42 主分类号 C08G59/42
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