| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in workability and useful as a resin for semiconductor sealing, a resin for laminated boards, a resin for coating materials, an adhesive, a molding material, an electrical insulating material, etc. SOLUTION: This epoxy resin composition comprises an epoxy resin containing an epoxy compound represented by formula (1) [wherein Z1 and Z2 are each formulas (2) and (3); R1 to R8 are each hydrogen atom or a 1-6C alkyl group; (n) is 0-6] and a curing agent for the resin. This epoxy resin composition for semiconductor sealing is obtained by compounding the above resin with inorganic filler.
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