| 摘要 |
<p>PURPOSE:To avoid the swelling of sealing resin making the defective appearance. CONSTITUTION:Within this lead frame for full mold package wherein multiple recessed grooves are formed in the rear side of a semiconductor chip mounting piece 300 whereon semiconductor chips are to be mounted, protrusions 420 are to be formed toward the inside of the rectangular grooves 400 at the ends of protrusions 410 between the rectangular grooves 400.</p> |
