<p>PURPOSE: A bump grid array package is provided to enhance productivity by improving a structure of ball grid array package. CONSTITUTION: A half etching process for the remaining bridge(32) except for a bump(31) of a metal bump frame(30) is performed. A part of the bump(31) is soaked in a plating bath including a solder solution by performing a deeping process. The bump(31) except for the bridge(32) is plated by the solder solution. The bump(31) of the metal bump frame(30) is aligned on a lower face of a printed circuit board(23). The bump(31) and a frame are aligned with one body. The metal bump frame(30) is loaded on a solder portion of a lower pattern layer(24b). The bump(31) is adhered to the lower pattern layer(24b) by performing a soldering process. The remaining part of the metal bump frame(30) except for the bump(31) is removed.</p>
