Method for manufacture electronic component device

摘要

The shapes of openings of a solder resist defining exposed portions of electrode pads and the shapes of openings of the solder resist defining the shapes of positioning signs are simultaneously formed by photolithography using the same mask pattern. As a result, the signs for registration can be easily formed on a main board or circuit boards. Also, it is possible to increase the positional accuracy of the signs relative to the positions of the electrode pads.