| 摘要 |
PROBLEM TO BE SOLVED: To obtain a radiation sensitive resin composition having high transparency to radiation as a chemical amplification type resist, excellent in basic physical properties as a resist such as dry etching resistance, sensitivity, resolution and pattern shape, causing no development defects in microfabrication and capable of producing a semiconductor device in a high yield. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or hardly alkali-soluble acid-dissociable group-containing resin typified by a resin having repeating units of the below formula 1 and (B) a radiation sensitive acid generating agent. The resin A is made alkali-soluble when the acid-dissociable group is dissociated. |
