| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit without need of fixing a voltage by an outer power supply while an unused input pad is subjected to bonding. SOLUTION: An input circuit is provided between an input pad 110 and a first stage input gate. And the input circuit has a judgment part 130 and a switch 140. The judgment part 130 judges whether there is bonding or not to the input pad 110 on the basis of the potential of the input pad 110. When the judgment part 130 judges that there is no bonding, a low level signal is generated from the switch part 140 to the first stage input gate. When the judgment part 130 judges that there is bonding, the first stage input gate and an input pad 110 are joined by the switching part 140. |
