| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board which can achieve fine and high density conductor patterns and realize the size reduction and thickness reduction of the board and the method of manufacturing the board. SOLUTION: A through-hole 4 is formed in a board comprising an insulating resin substrate 1 and a copper foil 2 laminated on it at a required position. A nonelectrolytic copper plating film 5 is formed on the inner wall of the through-hole 4 and the copper foil layer 2. The copper foil layer is formed into required conductor patterns 6 by etching. Further, the through-hole 4 is filled with conductive paste 7. |
