MANUFACTURING METHOD OF FILM CARRIER TAPE FOR MOUNTING ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To prevent a solder resist from flowing out between inner leads and on a wiring pattern formed on a flexible insulative film even though a film carrier tape for mounting an electronic component is a film carrier tape for mounting a fine-pitched electronic component. SOLUTION: The manufacturing method of a film carrier tape for mounting an electronic component is characterized by that a solder resist coating liquid is applied on the surface of a wiring pattern formed on a flexible insulative film and thereafter, the applied solder resist coating liquid is performed a primary heating treatment so that bubbles in the coating liquid are disappeared, then a secondary heating treatment is performed in the gaps between the films, which are formed by winding the film along with an emboss spacer, at a temperature lower than the heat curing starting temperature of a thermosetting resin being contained in the coating liquid.