| 摘要 |
PROBLEM TO BE SOLVED: To prevent a shortage of mounting area of an electronic component, which is caused by highly functional progress in system, when mounting an electronic component on a circuit board. SOLUTION: In a mold package type semiconductor device, each wiring 17 or 18 to be connected to a lead 12 or 13 and each electrode 19 or 20 to be connected to the wiring 17 or 18 are formed on a surface of a package 10. By connecting an electronic component 2 to the electrode 19 or 20, the number of components mounted on the circuit board can be reduced. |
