| 摘要 |
PROBLEM TO BE SOLVED: To reduce the number of assembling man-hours and improve cooling performance for a semiconductor device. SOLUTION: Bus bars 6c and 6ec are joined on an electrode face of a semiconductor chip 1 with an electrode on one face thereof. The plurality of bus bars 6c and 6ec joined with the semiconductor chip 1 are fixed with resin mold 12 to form a semiconductor module 13. In a semiconductor device, a cooler 9 is mounted on the semiconductor module 13 with an insulating body 14 in between. The bus bars 6c and 6ec are projected from the resin mold part at a mounting face of the cooler 9 on the semiconductor module 13. |
