| 摘要 |
PROBLEM TO BE SOLVED: To provide a three-dimensional circuit body, the circuit pattern of which is formed along the surface of a three-dimensional object, such as the car body frame, etc., and a method for forming the circuit body. SOLUTION: A three-dimensional circuit body 1 is constituted, by forming an insulating layer 3 on the surface of a three-dimensional, namely, undulating car body frame 1 and circuit patterns 4a and 4b on the surface of the layer 3 by applying conductive paste to the surface and simultaneously curing the paste. The pattern 4a is formed, by moving a discharging device 11 and a curing device 12 along the insulating layer 3 formed on the surface of the frame 1, and at the same time, simultaneously discharging and curing the conductive paste to and on the surface of the layer 3. Therefore, the manufacturing process of the circuit body 1 can be simplified and the reduction, etc., of materials becomes possible. |
