| 摘要 |
PROBLEM TO BE SOLVED: To provide a method by which a semiconductor device can be manufactured inexpensively with high mass-productivity. SOLUTION: In a method for manufacturing a semiconductor pellet 5, constituting a semiconductor element and having a GaAs substrate 1, a plurality of semiconductor elements 10 is formed with prescribed intervals on the substrate 1, and the substrate 1 carrying the elements 10 is worked to a prescribed thickness. In addition, an aluminum nitride plate 2, having nearby flat upper surface and grooves formed on the lower surface of the plate 2 at the same intervals as those of the elements 10, is prepared. The substrate 1 and aluminum nitride plate 2 are stuck to each other, and the stuck substrate 1 and aluminum nitride plate 2 are broken into pieces along the grooves 20 formed with the prescribed intervals on the rear surface of the plate 2. |
