| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device by which a device pattern is formed as designed, across the whole area of a semiconductor substrate to improve the manufacturing yield. SOLUTION: In a method of manufacturing a semiconductor device, including the steps of forming a photoresist pattern 2 on a semiconductor thin film formed on a substrate 1, etching the substrate 1 other than the substrate 1 covered with a photoresist pattern 2 by using a wet etching liquid to form a plurality of semiconductor device patterns 3, and dicing the device patterns 3 to form semiconductor devices 4, the photoresist pattern 2 is formed as designed in the central portion of the substrate 1, and is enlarged gradually in the direction starting from the central portion toward to the periphery. |
