MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE, AND ELECTRONIC DEVICE AND METHOD OF CONNECTING CONDUCTING PART

摘要

PROBLEM TO BE SOLVED: To electrically connect a plurality of planewise arranged semiconductor chips to one another with ease. SOLUTION: A coupling member 14 made of a shape memory alloy is interposed between a pair of semiconductor chips 10 and 12. The member 14 couples the chips 10 and 12 together with its clamping pawls 18, 20, 22, and 24 for integration. A wiring pattern 28 electrically connects arbitrary clamping pawls to each other. The pattern 28 comes in contact with pads 34 and 36 formed on the chips 10 and 12, respectively, to electrically connect the chips 10 and 12 to each other.