| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device suitable for high-density mounting without enlarging a wiring board nor reducing the pitch of solder balls, related to a semiconductor device wherein a semiconductor element is flip-chip jointed to one surface of the wiring board while the solder balls are formed in lattice on the opposite surface of the wiring board. SOLUTION: A semiconductor element 2 connected, with a solder bump 3, to a semiconductor element mounting surface 1a of a with board is electrically connected, in distributed manner, to a flat terminal 5 formed on the semiconductor element mounting surface 1a and a solder ball 4 on the opposite surface of the semiconductor element 1a. |
