| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin type or small type power semiconductor module. SOLUTION: A semiconductor module includes an insulating metallic substrate 1000 having a metallic plate 11 as a main terminal coated with an insulating resin layer 18, and a semiconductor element mounted on the metallic plate 11, connected to the metallic plate and mounted in a package 10. By using the metallic plate of the insulating metallic plate as the main terminal, the power semiconductor module can be made thin or small. |
