| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame for forming an outer lead that secures a highly accurate pitch after resin sealing, a semiconductor device, its manufacturing method, and electronic equipment. SOLUTION: A lead frame 10 includes a plurality of inner leads 16 for arranging in a resin-sealing region, a plurality of outer leads 18 for arranging outside the resin-sealing region, an outer frame 12, and a connection part 22 for connecting the outer lead 18 to the outer frame 12. Also, a pitch P1 near the boundary position with the outer lead 18 of the inner lead 16 and a pitch P2 near the boundaty position of the outer lead 18 are in a relationship P1>P2. |
