发明名称 VIA-HOLE CONNECTION STRENGTH MEASUREMENT DEVICE AND MEASUREMENT METHOD
摘要 PROBLEM TO BE SOLVED: To quantitatively measure the connection strength of a via-hole formed in a build-up board. SOLUTION: A measuring jig 7 is transferred in a direction parallel with a land surface 6 to which a via-hole 5 is connected, i.e., in a direction perpendicular to the center axis 'A' of the via-hole 5, to apply a shearing stress to the via-hole 5 with the jig 7. The connection strength of the via-hole is defined as a shearing load applied to the jig 7, when the via-hole is sheared and broken by the applied stress.
申请公布号 JP2001111238(A) 申请公布日期 2001.04.20
申请号 JP19990288523 申请日期 1999.10.08
申请人 SUMITOMO METAL ELECTRONICS DEVICES INC 发明人 MIURA MINORU;NISHIKADO TORU;KISHIMOTO YOSHIHISA;TAKEMOTO YUICHI
分类号 H05K3/00;G01L1/00;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/00
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