发明名称 |
VIA-HOLE CONNECTION STRENGTH MEASUREMENT DEVICE AND MEASUREMENT METHOD |
摘要 |
PROBLEM TO BE SOLVED: To quantitatively measure the connection strength of a via-hole formed in a build-up board. SOLUTION: A measuring jig 7 is transferred in a direction parallel with a land surface 6 to which a via-hole 5 is connected, i.e., in a direction perpendicular to the center axis 'A' of the via-hole 5, to apply a shearing stress to the via-hole 5 with the jig 7. The connection strength of the via-hole is defined as a shearing load applied to the jig 7, when the via-hole is sheared and broken by the applied stress. |
申请公布号 |
JP2001111238(A) |
申请公布日期 |
2001.04.20 |
申请号 |
JP19990288523 |
申请日期 |
1999.10.08 |
申请人 |
SUMITOMO METAL ELECTRONICS DEVICES INC |
发明人 |
MIURA MINORU;NISHIKADO TORU;KISHIMOTO YOSHIHISA;TAKEMOTO YUICHI |
分类号 |
H05K3/00;G01L1/00;H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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