发明名称 SUBSTRATE TREATMENT EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To reduce the load on a wafer carrying means and improve throughout, in e.g. coating equipment and developing equipment. SOLUTION: In a treatment station S2 performing coating of resist or the like, a first treatment part group containing a reflection preventing film forming unit B, a coating unit C and a cooling part 3 is arranged in parallel to the arrangement direction of a cassette 22 of a cassette station S1 delivering the cassette 22 and adjacently to the station S1. Neighboring the first treatment part group, a third treatment part group containing a shelf unit R and a second treatment part group containing a developing unit D are arranged in this order oppositely to the first treatment part group. Water carrying means MA1, MA2 are arranged between the first and second treatment part groups and between the second and third treatment part groups, respectively. As a result, delivery of a wafer W is enabled to the first treatment part group by using a delivering arm 23 of the cassette station S1, and the load of the wafer carrying means MA can be reduced.
申请公布号 JP2001110701(A) 申请公布日期 2001.04.20
申请号 JP19990285325 申请日期 1999.10.06
申请人 TOKYO ELECTRON LTD 发明人 TAKEKUMA TAKASHI;UEDA KAZUNARI
分类号 H01L21/677;H01L21/027;(IPC1-7):H01L21/027 主分类号 H01L21/677
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