| 摘要 |
PROBLEM TO BE SOLVED: To efficiently form protrusions functioning as, e.g. bump electrodes on one main plane of a multilayer ceramic board manufactured by via the baking step of a non-shrinkage process. SOLUTION: A composite laminate 29 has shrink suppressing green sheets 25, 26 laminated on main planes 31, 32 of a board forming laminate 30 composed of board forming green sheets 24, and cavities 33, 34 having opening ends 35, 36 closed with the main plane 31. The cavities 33, 34 are formed by holes 27, 28 of the shrinkage-suppressing green sheet 25. The composite laminate 29 is baked to result in the shrink suppressing green sheets 25, 26 being not sintered exert restricting forces on the board forming laminate 30 to raise a part of this laminate 30 along the inner surface of the cavities 33, 34, thereby forming protrusions and first ends of the via conductors 5, 6 located on the tops of the protrusions so as to give bump electrodes. |
