发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To connect a part of a gate electrode wiring material with a part of a source/drain region with a joint of low resistance. SOLUTION: A gate insulating film, a gate electrode wiring material, a source/drain region, and a side wall are successively formed on the surface of a first conductivity-type semiconductor substrate, a side wall of the gate electrode wiring material of a second transistor formed on the source/drain region of a first transistor is removed using a resist pattern as a mask, and then a salicide is formed. A part of the gate electrode wiring material can be connected to a part of the source/drain with a joint of low resistance.
申请公布号 JP2001110912(A) 申请公布日期 2001.04.20
申请号 JP20000282378 申请日期 2000.09.18
申请人 SEIKO EPSON CORP 发明人 INOUE SUSUMU
分类号 H01L21/28;H01L21/768;H01L21/8234;H01L21/8244;H01L27/088;H01L27/11 主分类号 H01L21/28
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