| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip, a method of manufacturing the semiconductor chip, a semiconductor device, a circuit board, and an electronic device, wherein semiconductor chips can be laminated using no interposers, and wherein the laminated semiconductor chips can be electrically connected independently of their size. SOLUTION: In a semiconductor chip 10, fillers 22 made of copper are attached to recesses formed so as to extend between electrode pads 20 and side surfaces 14 of the chip 10, respectively. Further, an insulating member 40 is provided except for portions of each side surface 14 to which the members 22 are exposed. As a result, the side surfaces of the chip 10 can be used for electrical connection, and thus a semiconductor device wherein semiconductor chips can be laminated without interposers can be manufactured with ease. |
