| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling method and means for a circuit integration body in a package of especially a gas-separation structured multilayer integrated circuit. SOLUTION: A hydrogen absorbing alloy 5 for sealing a high-pressure hydrogen gas or a heavy hydrogen gas into the inside of the ceiling part of preferably a top lid as a gas heating medium for dissipating heat and for stably supplying the hydrogen gas or the heavy hydrogen gas as needed is provided at a ceiling 6 in an internal closed space 7 of a package. Also, a blower for forcibly circulating the gas between integrated circuit pieces inside the package as needed is provided.
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