发明名称 WIRING PATTERN ON WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring pattern on a wiring board which allows components to be highly integrated by lessening dead spaces and can realize stable operation of circuits themselves. SOLUTION: On a wiring board which mounts a QFPIC and has a front lead land group and a rear lead land group, lands for components are disposed in spaces formed between the respective lead land groups.
申请公布号 JP2001111206(A) 申请公布日期 2001.04.20
申请号 JP19990292447 申请日期 1999.10.14
申请人 DIAMOND ELECTRIC MFG CO LTD 发明人 IKEMOTO TADASUKE
分类号 H05K3/34;(IPC1-7):H05K3/34 主分类号 H05K3/34
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