发明名称 |
WIRING PATTERN ON WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a wiring pattern on a wiring board which allows components to be highly integrated by lessening dead spaces and can realize stable operation of circuits themselves. SOLUTION: On a wiring board which mounts a QFPIC and has a front lead land group and a rear lead land group, lands for components are disposed in spaces formed between the respective lead land groups.
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申请公布号 |
JP2001111206(A) |
申请公布日期 |
2001.04.20 |
申请号 |
JP19990292447 |
申请日期 |
1999.10.14 |
申请人 |
DIAMOND ELECTRIC MFG CO LTD |
发明人 |
IKEMOTO TADASUKE |
分类号 |
H05K3/34;(IPC1-7):H05K3/34 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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