| 摘要 |
PROBLEM TO BE SOLVED: To improve wiring reliability while suppressing the generation of void by improving the burial property of metal into a connection hole, preventing an oxide film from being formed on a barrier layer that is formed in the connection hole, and improving electromigration resistance. SOLUTION: The manufacturing method is provided with a process for forming a barrier layer 25 on the inner surface of a recessed part 24 (a groove 22 and a connection hole 23) being formed at an insulation film 21 on a substrate 10, a process for forming a plating seed layer 26 on the surface of the barrier layer 25 by sputtering or the like by keeping the barrier layer 25 in non-oxidation atmosphere, and a process for applying a solution 31 containing a metal particle at least in the recessed part 24. After that, the inside of the recessed part 24 is buried with a metal plating layer, thus forming wiring (second wiring 28) and a plug 29.
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