| 摘要 |
PROBLEM TO BE SOLVED: To provide a BGA wiring tape and a BGA package which are improved in reliability to thermal stress by a method wherein the thermal stress of a semiconductor chip mounted on a wiring tape has a less effect on an S- shaped inner lead. SOLUTION: A BGA wiring tape has such a structure where an easily separating part of high-molecular resist 5 which enables a leading wiring 3 or inner leads 4 to separate easily from a base film 2 is provided to a boundary between the leading wiring 3 and the inner leads 4 on the base film 2. Outer connection solder balls 9 are arranged in an array on lands 8, a wiring separate part 7 formed as separated from the base film 2 is provided to the leading wiring 3 or the S-shaped inner leads 4, and the S-shaped inner leads 4 and chip electrodes 12 are connected together and sealed up with insulating epoxy resin sealing agent 13 for the formation of a BGA package. |
