STRUCTURE FOR PACKAGING HIGH SPEED SIGNAL TRANSMISSION WIRE

摘要

PROBLEM TO BE SOLVED: To provide high speed signal transmission wire packaging structure capable of reducing jitters by suppressing the timewise oscillation of a signal caused by a reflected wave reciprocally transmitted through a transmission wire for connecting a transmitting side semiconductor device to a receiving side semiconductor device especially in a signal transmission system consisting of the transmitting side and the receiving side. SOLUTION: A distance from a node between an output circuit of a semiconductor device 15a to be an impedance mismatched position of a transmitting substrate 100 and an output wire 16a to a node 26 to be an impedance mismatched position of a receiving substrate 200 is determined so that signal transmission time becomes integer times a half of a signal switching period. Consequently the influence of jitters due to a signal reflected by each of impedance mismatched positions of both the substrates 100, 200, is restrained so that the high speed signal transmission wire packaging structure capable of resisting signal transmission of a short signal switching period can be provided.