发明名称 PRINTED WIRING BOARD FOR RELIABILITY EVALUATION
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board for reliability evaluation which enables the accurate reliability evaluation of punching workability as well as the reliability evaluation of a wiring part. SOLUTION: A printed wiring board 10 comprises a board 11 and a wiring part 20 consisting of conductive patterns 21, 22 and 23. The board has a plurality of evaluation pattern regions 12, 13 and 14. At least, one region 12 among the evaluation pattern regions has the pattern 21 suitable for the reliability evaluation of punching workability.
申请公布号 JP2001111183(A) 申请公布日期 2001.04.20
申请号 JP19990290111 申请日期 1999.10.12
申请人 SONY CORP 发明人 KOWA YUKIKO
分类号 H05K1/02;H05K3/00;(IPC1-7):H05K1/02 主分类号 H05K1/02
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