PROBING METHOD AND DEVICE

摘要

PROBLEM TO BE SOLVED: To obtain a probing device which is capable of obtaining a constant contact load even if a probe card is changed in shape with time or a distance between the tip of a probe and a wafer W varies due to expansion or shrinkage caused by a thermal influence in a check by a method wherein a main chuck whose overdrive is kept constant in a conventional device is regulated in quantity of overdrive. SOLUTION: This probing method is carried out through such a manner where a wafer placed on a main chuck 17 is brought into contact with a probe 24A under the control of a controller 13. When the main chuck is overdriven to check the electric properties of the wafer W, a load produced when a probe 24A is brought into contact with the wafer W by overdriving the main chuck 17 under the control of the controller 13 is measured through the intermediary of a pressure sensor 31 provided to the main chuck 17, and the main chuck 17 is regulated in quantity of overdrive resting on the measured load.