| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, a semiconductor chip, and a manufacturing method of the semiconductor device for inspecting a joining position of the semiconductor chip with respect to a solid device without separating the solid device and the semiconductor chip. SOLUTION: Joining position inspecting marks 12 and 22 made of infrared-ray reflecting material for inspecting the joining position are formed on a surface of a sub-chip 20 and a main chip 10. After the main chip 10 and the sub-chip 20 are joined to each other, the joining position inspecting marks 12 and 22 are imaged from the rear side of the sub-chip 20 by an infrared ray camera 50. On the basis of the infrared image of the joining position inspecting marks 12 and 22, the joining position of the sub-chip 20 to the main chip 10 can be inspected. |
