发明名称 POLISHING PAD
摘要 PROBLEM TO BE SOLVED: To provide a polishing pad where the optical detection of the end of polishing is possible and besides the equality of polishing is favorable, and a polishing end detection method using it, and a polisher equipped with it. SOLUTION: In a polishing pad used for a chemical/mechanical polisher, the polishing layer of that polishing pad has a polishing region which has bubbles and a light transmissive region which has bubbles, and besides relation between the number (n1) of bubbles extending in the vertical direction of the polishing region and the number (n2) of bubbles existing in the vertical direction of the light transmissive region is such that n1>n2>0.
申请公布号 JP2001110762(A) 申请公布日期 2001.04.20
申请号 JP19990282477 申请日期 1999.10.04
申请人 ASAHI KASEI CORP 发明人 KOIKE HISAO;IKEDA AKIHIKO
分类号 B24B37/20;B24B37/24;H01L21/304 主分类号 B24B37/20
代理机构 代理人
主权项
地址